LASER DIRECT STRUCTURING

Laser Direct Structuring (LDS) or 3-Dimensional Molded Interconnect Devices (3D-MID) refer to a process where metal can be plated selectively on a plastic. Commonly used for antennas.

Suitable Materials

Vectra 840i or whatever.If you want to SMT on LDS part you need something with high heat resistance

Design Guidelines

Category/Feature	Description of design guideline	Image
Vias	1. wall thickness 300 μmmax 2. hole diameter 300 μm min 3. angle 50° min 4.wall thickness 600 μm max.
Plating	Chemical copper plating should be less than 8um
Vestige	Injection gate should not be on the pattern area and at least 0.2mm away from LDS pattern. If this is not possible, the ejection pins must have 30° degree angle and the flash form should be less than 0.05 mm
Edge radius	Recommended > 150μm
Distance to wall	Recommended > 150μm
Distance to edge	Recommended > 150μm. This is very critical if pattern is needed on side face. Can maybe go less if there is no cosmetic requirements.

Suppliers

These companies provides MID contract manufacturing capabilities using LPKF laser direct structuring technology from in North America. Their services include engineering support, injection molding, laser structuring and metallization which allows for excellent turnaround.

Example Gallery

Resources

• Design For LDS Process
• LDS-MID-Design-Guide